Apparatus for mounting conductive ball

ABSTRACT

Provided is an apparatus for mounting a conductive ball, and more particularly, an apparatus for mounting a conductive ball, whereby defects during a process of mounting a conductive ball on a substrate by using a mounting hole formed in a mask may be prevented, and a conductive ball having a small size may also be effectively mounted on the substrate. According to the apparatus for mounting a conductive ball, a process of mounting a conductive ball may be performed by preventing deformation of a mask, thus achieving a high quality of the process without missing any conductive balls.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of Korean Patent Application No.10-2018-0135515, filed on Nov. 7, 2018, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND 1. Field of the Invention

One or more embodiments relate to an apparatus for mounting a conductiveball, and more particularly, to an apparatus for mounting a conductiveball, whereby defects during a process of mounting a conductive ball ona substrate by using a mounting hole formed in a mask may be prevented,and a conductive ball having a small size may also be effectivelymounted on the substrate.

2. Description of the Related Art

When mounting, for example, a semiconductor device such as a large-scaleintegration (LSI) device, a liquid-crystal display (LCD), a conductiveball such as a solder ball is frequently used for electrical connection.

A conductive ball has a very small particle shape having a diameter ofabout 1 mm or less. A conductive ball is mounted on a substrate and usedto electrically mount the substrate. In general, a mask in which amounting hole is formed disposed on a substrate printed with a flux, anda conductive ball is transferred to the substrate via the mounting holeto temporarily adhere the conductive ball via the flux to thereby mountthe conductive ball on the substrate.

Recently, semiconductor devices have become highly integrated andcompact, and the size of conductive balls has also been reducedsignificantly. In addition, the number of conductive balls mounted usinga mask has been increased.

Accordingly, an apparatus for mounting a conductive ball to effectivelyperform a process of mounting tens of thousands or hundreds of thousandsof conductive balls each having a size less than 100 μm is required.

When mounting conductive balls having a small size as above, a maskhaving a similar thickness to the size of the conductive balls is used.When using a thin mask as described above, the possibility of a defectthat conductive balls are not mounted in mounting holes of the maskincreases. In addition, time for mounting conductive balls in mountingholes also increases.

Thus, there is the need for an apparatus for mounting a conductive ball,which is capable of mounting a conductive ball in a mounting hole of amask at a high speed and reducing the possibility of a defect thatconductive balls are not mounted in mounting holes at the same time.

Using a thin mask is likely to cause deformation of the mask such asbending. A substrate disposed under the mask also has an easily bendablestructure. When the substrate and the mask are bent, a gap is formedbetween the substrate and the mask and a defect that a conductive ballmounted in a mounting hole escaping through the gap may be caused. Themissing of conductive balls out of the gap between the substrate and themask that may be present around the mounting hole can also be a cause ofa process defect. Also, due to this gap, a defect that two conductiveballs are mounted in one mounting hole may be caused.

Thus, an apparatus for mounting a conductive ball, capable of preventingdeformation of a mask and thus defects, and also quickly mountingmultiple small-sized conductive balls on a substrate by using the maskis required.

SUMMARY

One or more embodiments include an apparatus for mounting a conductiveball, whereby a small-sized conductive ball may be quickly mounted on asubstrate without missing the conductive balls.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments, an apparatus for mounting aconductive ball, includes: a mask including a plurality of mountingholes formed such that a plurality of conductive balls is respectivelymounted in the plurality of mounting holes; a support plate supportingthe mask to prevent deformation of the mask by blocking a lower portionof each of the plurality of mounting holes by contacting a lower surfaceof the mask; a mounting unit mounting the plurality of conductive ballsin the plurality of mounting holes of the mask while the mask is beingsupported by the support plate; a holding unit contacting an uppersurface of the mask to maintain the conductive balls respectivelymounted in the mounting holes of the mask, in a state of being mountedin the mounting holes; a transporting unit placing the substrate belowthe mask by transporting at least one of the mask, the support plate,and a substrate that is coated with a flux, while the holding unitmaintains the conductive balls in the state of being mounted in themounting holes of the mask; and a controller controlling operation ofthe mounting unit, the holding unit, and the transporting unit.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1 is a structural diagram of an apparatus for mounting a conductiveball, according to an embodiment of the present disclosure;

FIGS. 2 through 5 are views for describing an operation of the apparatusfor mounting a conductive ball, illustrated in FIG. 1; and

FIG. 6 is a view of an operation of the apparatus for mounting aconductive ball, illustrated in FIG. 1 and corresponding to FIG. 5,according to another embodiment of the present disclosure.

DETAILED DESCRIPTION

Hereinafter, an apparatus for mounting a conductive ball, according tothe present disclosure will be described with reference to the drawings.

FIG. 1 is a structural diagram of an apparatus for mounting a conductiveball, according to an embodiment of the present disclosure.

Referring to FIG. 1, the apparatus for mounting a conductive ball,according to the present embodiment, includes a mask 100, a supportplate 200, a mounting unit 300, and a holding unit 400.

The mask 100 is in the form of a thin and flat metal plate. A pluralityof mounting holes 101 are formed in the mask 100. The mask 100 is usedto mount conductive balls B on a substrate 10. The mounting holes 101are formed in the mask 100 at positions corresponding to positions whereconductive balls B are to be mounted on the substrate 10. To prevent twoor more conductive balls B from being mounted in one mounting hole 101of the mask 100, the mask 100 has a thickness that is approximatelysimilar to or slightly less than a diameter of the conductive balls B.

The support plate 200 is placed under the mask 100. The support plate200 is mounted to be movable relative to the mask 100 by using atransporting unit 500 which will be described later. The support plate200 is placed at a position in contact with a lower surface of the mask100 to support the lower surface of the mask 100. The mask 100 has arelatively broad area compared to its thickness, and is thus likely todeform downwards by its own weight. The support plate 200 has a functionof preventing deformation of the mask 100 by supporting the mask 100while being in contact with the lower surface of the mask 100. Inaddition, the support plate 200 contacting the lower surface of the mask100 thereby blocks lower portions of the mounting holes 101 formed inthe mask 100. As a result, the conductive balls B mounted in themounting holes 101 of the mask 100 do not escape downwards but are keptaccommodated in the mounting holes 101 due to the support plate 200.

The support plate 200 according to the present embodiment includes alight-emitting portion 210 and a first adsorption member 210 formed of aporous material. The first adsorption member 210 has a planar plateshape and is placed to contact the lower surface of the mask 100. When avacuum pump is connected to the first adsorption member 210, a flow ofthe air flowing downwards under the mounting holes 101 induces theconductive balls B to be mounted in the mounting holes 101. In addition,the first adsorption member 210 has a function of preventing theconductive balls B from escaping the mounting holes 101 and ofmaintaining the conductive balls B as being accommodated in the mountingholes 101 and attached to the first adsorption member 210 in thataccommodated state. According to the present embodiment, the firstadsorption member 210 of the support plate 200 is formed of atransparent material. The light-emitting portion 201 of the supportplate 200 is formed of a light-emitting diode (LED) lamp. When thelight-emitting portion 201 emits light, the light is transmitted throughthe first adsorption member 210 which is formed of a transparentmaterial, thereby illuminating the lower surface of the mask 100 and themounting holes 101.

The mounting unit 300 is placed on the mask 100. The mounting unit 300is transported horizontally via the transporting unit 500. In thepresent embodiment, the mounting unit 300 having a cyclone head shape isused. A cyclone head has a structure including a cylindrical chamberaccommodating a plurality of conductive balls B, and a compressed air isjetted into the chamber. In the present embodiment, a cyclone headhaving various well-known structures may be used as the mounting unit300. When the mounting unit 300 is moved along an upper surface of themask 100, the conductive balls B accommodated in the chamber of themounting unit 300 are moved in an arbitrary direction and then mountedin the mounting holes 101 under the mounting unit 300. According tocircumstances, a mounting unit having a different structure from acyclone head may also be used. A mounting unit including a brush or asqueegee moving relative to the mask 100 may also be used to mount theconductive balls B in the mask 100.

The holding unit 400 is placed on the mask 100. The holding unit 400 isinstalled to be transported horizontally and vertically via thetransporting unit 500. The holding unit 400 is in contact with the uppersurface of the mask 100 to maintain the conductive balls B as beingmounted in the mounting holes 101. That is, even when the support plate200 under the mask 100 is moved and thus does not support the lowersurface of the mask 100 anymore, the holding unit 400 may keep theconductive balls B as being accommodated in the mounting holes 101 andprevent the conductive balls B from falling downwards.

The holding unit 400 may have various structures. For example, anadsorption member having a similar structure to that of the firstadsorption member 210 described above or an electrostatic chuck may beused as the holding unit 400. In the present embodiment, the holdingunit 400 having a structure including an electrostatic chuck will bedescribed as an example. The electrostatic chuck of the holding unit 400performs a function of clamping an object by generating an electrostaticforce via an electric power applied. In the present embodiment, theelectrostatic chuck of the holding unit 400 may contact the uppersurface of the mask 100 to clamp the mask 100 and the conductive balls Brespectively accommodated in the mounting holes 101. When a controllereliminates the electrostatic force of the electrostatic chuck, theconductive balls B accommodated in the mounting holes 101 falldownwards.

The transporting unit 500 includes a support plate transporting unit510, a holding unit transporting unit 530, and a substrate transportingunit 520. As described above, the support plate transporting unit 510 ofthe transporting unit 500 transports the support plate 200 relative tothe mask 100. The holding unit transporting unit 530 of the transportingunit 500 transports the holding unit 400 relative to the mask 100. Inaddition, the substrate transporting unit 520 of the transporting unit500 transports the substrate 10 relative to the mask 100 in horizontaland vertical directions.

In the present embodiment, the substrate transporting unit 520 moves thesubstrate 10 including a pad 11 coated with a flux used to attach theconductive balls B, under the mask 100. According to necessity, thesubstrate transporting unit 520 transports the substrate 10 at a closedistance to the lower surface of the mask 100 of the substrate 10.

The transporting unit 500 also performs a function of transporting themounting unit 300 and other elements such as an inspection camera 600 orthe like.

The controller controls operations of main elements including theholding unit 400, the transporting unit 500, and the mounting unit 300described above.

The inspection camera 600 is placed above the mask 100. The inspectioncamera 600 is installed to be movable by the transporting unit 500 in adesired direction. The inspection camera 600 captures an image of themask 100 placed thereunder. The image captured using the inspectioncamera 600 is transmitted to the controller and used in inspecting amounting state of the conductive balls B in the mounting holes 101.

A separation unit separates the conductive balls B attached to theholding unit 400, from the holding unit 400. As described above, theconductive balls B are attached to the holding unit 400 via theelectrostatic chuck, and when operation of the electrostatic chuck isstopped, the conductive balls B are separated from the holding unit 400.The separation unit 530 facilitates separation of the conductive ball Bfrom the holding unit 400.

According to the present embodiment, the holding unit transporting unit530 of the transporting unit 500 performs a function of the separationunit. After an electrostatic force of the electrostatic chuck iseliminated, when the holding unit transporting unit 530 horizontallyslides the holding unit 400 with respect to the mask 100, the conductiveballs B attached to the holding unit 400 are easily separated from theholding unit 400.

Hereinafter, an operation of the apparatus for mounting a conductiveball configured as described above will be described.

First, as illustrated in FIG. 2, the transporting unit 500 is operatedto bring the support plate 200 into contact with the lower surface ofthe mask 100. In this state, the controller operates the mounting unit300 to respectively mount the conductive balls B in the mounting holes101 of the mask 100.

By bringing the support plate 200 into contact with the lower surface ofthe mask 100 as described above, bending or warpage of the mask 100 maybe prevented. As semiconductor processes have become sophisticated,conductive balls B having a size smaller than 100 μm are frequentlyused. In this case, even a very little deformation of the mask 100 maycause a defect of a process of mounting conductive balls B. According tothe present disclosure, the mounting unit 300 is operated whilesupporting the lower surface of the mask 100 by using the support plate200, and thus, bending or warpage of the mask 100 may be prevented, andthe process of mounting conductive balls B may be effectively performedat the same time. Thus, omitting the conductive balls B when mountingthe conductive balls B in the mounting holes 101 may be prevented or theconductive balls B mounted in the mounting holes 101 may be preventedfrom escaping through a gap generated due to deformation of the mask100.

In addition, as the lower surface of the mask 100 is adsorbed using thefirst adsorption member 210 of the support plate 200 as described above,the mask 100 maintains a flat state while being closely adhered to anupper surface of the support plate 200. As vacuum applied to the firstadsorption member 210 is transferred not only to the lower surface ofthe mask 100 but also to the mounting holes 101, the conductive balls Bare even more effectively mounted in the mounting holes 101. Once theconductive balls B are mounted in the mounting holes 101, the conductiveballs B are continuously adsorbed by an upper surface of the firstadsorption member 210 via vacuum. Thus, even when the conductive balls Bcollide with a compressed air applied by the mounting unit 300 or withother conductive ball B, the conductive balls B do not escape out of themounting holes 101. Consequently, time for performing a process ofmounting the conductive balls B in the mounting holes 101 of the mask100 may be reduced.

When the mounting unit 300 completes the process of mounting theconductive balls B, the controller moves the mounting unit 300 to a sideof the mask 100 as illustrated in FIG. 3 to put the same on standby.Next, the controller operates the light-emitting portion 201 to turn ona LED lamp. The light generated in the light-emitting portion 201 isilluminated to the lower surface of the mask 100 via the firstadsorption member 210 formed of a transparent material.

The controller operates the transporting unit 500 to transport theinspection camera 600 to a position above the mask 100, and theinspection camera 600 captures an image of the mask 100. When aconductive ball B is not mounted in some of the mounting holes 101 ofthe mask 100, light generated in the light-emitting portion 201 isilluminated upwards through the mounting holes 101.

The controller inspects a mounting state of the conductive balls Bmounted in the mounting holes 101 of the mask 100 based on the imagecaptured using the inspection camera 600. The controller may easilyinspect whether the mounting holes 101 are empty based on whether brightimages of the mounting holes 101 are captured. When the controllerdetermines a position of a mounting hole 101 that is empty, the mountingunit 300 is operated again to mount a conductive ball B at thatposition. The controller operates the transporting unit 500 to transportthe mounting unit 300 to the position of the mounting hole 101 that isempty, and operates the mounting unit 300 to mount a conductive balls Balso in the mounting hole 101 that is empty.

As described above, by using the first adsorption member 210 of atransparent material, the light-emitting portion 201, and the inspectioncamera 600, whether the conductive balls B are mounted may be inspectedeasily. In addition, a conductive ball B may be immediately filled inthe mounting holes 101 that are empty. Whether the conductive balls Bare mounted or not may be immediately inspected after operation of themounting unit 300 as described above, and thus, the quality of themounting process of conductive balls B and a process rate of the processmay be remarkably improved according to the present disclosure.

When the mounting process of the conductive balls B in the mountingholes 101 is completed as described above, a process of maintaining theconductive balls B as being mounted in the mounting holes 101 by usingthe holding unit 400 is performed as illustrated in FIG. 3. First, thetransporting unit 500 transports the mounting unit 300 to an edge of themask 100. Then the controller brings the holding unit 400 into contactwith the upper surface of the mask 100 by using the transporting unit500. Then the controller stops operation of the first adsorption member210 before or right after operating the holding unit 400.

When the controller operates the electrostatic chuck of the holding unit400, due to an electrostatic force generated in the electrostatic chuck,the mask 100 and the conductive balls B are closely adhered to a lowersurface of the holding unit 400. As the controller has stopped operationof the first adsorption member 210, the mask 100 and the conductiveballs B that are closely adhered to the support plate 200 via the firstadsorption member 210 are spontaneously closely adhered to the lowersurface of the holding unit 400. Here, the conductive balls B are stillmounted in the mounting hole 101 of the mask 100 and attached to theelectrostatic chuck in that state. As the mask 100 is closely adhered tothe electrostatic chuck, there is no gap through which the conductiveballs B may escape, in an upper portion of the mounting holes 101. As aresult, the conductive balls B are maintained as being firmly attachedto the holding unit 400. Even when the transporting unit 500 separatesthe support plate 200 from the lower surface of the mask 100, theconductive balls B do not move from the mask 100.

Next, as illustrated in FIG. 4, the controller moves the support plate200 to another position and transports the substrate 10 to a relativelyclose position to the lower surface of the mask 100. Here, thecontroller controls the substrate transporting unit 520 of thetransporting unit 500 to align the substrate 10 with respect to the mask100 in a horizontal direction and raise the substrate 10 to a closeposition to the lower surface of the mask 100. The substratetransporting unit 520 moves the substrate 10 relative to the mask 100 byclamping the substrate 10 by adsorbing a lower surface of the substrate10. Here, the substrate transporting unit 520 may move the substrate 10to a position where the substrate 10 is as close as possible to the mask100 but does not contact the mask 100.

Next, as illustrated in FIG. 5, an operation of dropping the conductiveballs B mounted in the mounting holes 101 and attaching the conductiveballs B to the substrate 10 is performed. When the controller stopsoperation of the holding unit 400, the electrostatic force of theelectrostatic chuck does not act anymore. The conductive balls Battached to the holding unit 400 pass by the mounting holes 101 to fallonto the substrate 10. As a flux is previously coated on the pad 11 ofthe substrate 10 to which the conductive balls B are to be attached, theconductive balls B fallen on the substrate 10 are temporarily adhered tothe substrate 10 by the flux. The conductive balls B are heated in areflow process together with the substrate 10 to be adhered to thesubstrate 10.

Due to the electrostatic force remaining on the holding unit 400 or anelectrostatic force that is generated between the holding unit 400 andthe conductive balls B, some conductive balls B may not be separatedfrom the holding unit 400 but remain thereon. Particularly whenconductive balls B having a very small size of 100 μm or less are used,this phenomenon is likely to occur frequently.

A separation unit may be used when the conductive balls B are not easilyseparated from the holding unit 400.

The separation unit is used to separate the conductive balls B from theholding unit 400. As a separation unit separating the conductive balls Bfrom the holding unit 400, various elements may be used. For example,the conductive balls B may be separated from the holding unit 400 byjetting a compressed air between the mask 100 and the holding unit 400.In addition, a separation unit applying a small impact to the holdingunit 400 may be used.

In the present embodiment, the holding unit transporting unit 530transporting the holding unit 400 is used as a separation unit 530 andwill be described as an example. When the controller stops operation ofthe holding unit 400, the conductive ball B falls onto the substrate 10.As illustrated in FIG. 5, the holding unit 400 is finely slidhorizontally with respect to the mask 100 by using the holding unittransporting unit 530. Falling of the conductive balls B onto thesubstrate 10 through the mounting holes 101 is accelerated by sliding ofthe holding unit 400. The conductive balls B are here accommodated inthe mounting holes 101, and thus do not move even when the holding unit400 is moved horizontally. The conductive balls B are maintained in themounting holes 101 and then fall downwards. The conductive balls B thathave fallen downwards by their own weight are attached to the substrate10. By using the separation unit 530 as described above, a quality ofthe operation of attaching the conductive balls B to the substrate 10and the operational speed may be improved. That is, a defect ratio ofthe process of mounting conductive balls B may be significantly reduced.

According to the present disclosure, the operation of mountingconductive balls B in the mounting holes 101 is performed while the mask100 is supported using the support plate 200 which has a flat plateshape, and thus, the operation of mounting the conductive balls B may beperformed while preventing deformation of the mask 100 such as bendingor warpage. By preventing deformation of the mask 100, defects in theoperation of mounting the conductive balls B may be effectivelyprevented, for example, when mounting conductive balls B having a verysmall size or when the mask 100 having a small thickness is used.

In addition, also when the support plate 200 does not support the lowersurface of the mask 100 as illustrated in FIG. 4, the holding unit 400holds and supports the mask 100 and the conductive balls B from above,thereby preventing deformation of the mask 100. Accordingly, theconductive balls B mounted in the mounting holes 101 may be preventedfrom escaping.

In addition, as illustrated in FIG. 5, the conductive balls B are bondedto the substrate 10 while supporting the lower surface of the substrate10 in a flat state by using the substrate transporting unit 520, andthus, deformation of the substrate 10 is also prevented. Accordingly,leakage of the conductive balls B mounted in the mounting holes 101without being attached to the pad 11 of the substrate 10 may beprevented.

While the present disclosure has been described with reference topreferred embodiments, the scope of the present disclosure is notlimited to the above described and illustrated structures.

For example, the first adsorption member 210 of the support plate 200 isdescribed above as being formed of a transparent material, a firstadsorption member that is not transparent may also be used. In addition,an apparatus for mounting a conductive ball according to the presentdisclosure may also be configured such that a support plate does notinclude the first adsorption member 210 but simply supports the lowersurface of the mask 100. An apparatus for mounting a conductive ballaccording to the present disclosure may also be configured by includinga support plate that does not have an adsorption function but ispartially formed of a transparent material to illuminate the mountingholes 101.

In addition, an apparatus for mounting a conductive ball according tothe present disclosure may also be configured without including theinspection camera 600.

In addition, while the holding unit 400 including an electrostatic chuckto hold the mask 100 and the conductive balls B is described above, aholding unit 410 having a structure as illustrated in FIG. 6 may also beused. In this case, the holding unit 410 includes a second adsorptionmember 411 formed of a porous material. While being in contact with theupper surface of the mask 100, the second adsorption member 411 adsorbs,from above, conductive balls B mounted in mounting holes 101. That is,the holding unit 410 in the form as illustrated in FIG. 6 holds the mask100 and the conductive balls B by adsorbing the mask 100 and theconductive balls B. In this case, when the substrate 10 is placed belowthe mask 100, the controller stops operation of the second adsorptionmember 411 of the holding unit 400 such that the conductive balls Bmounted in the mounting holes 101 fall onto the substrate 10.

In addition, an apparatus for mounting a conductive ball may also beconfigured without a separation unit as described above, or an apparatusfor mounting a conductive ball may be configured by including aseparation unit having a different structure than the above-describedone.

In addition, while the mounting unit 300 in the form of a cyclone headis described above as an example, an apparatus for mounting a conductiveball may also be configured to mount conductive balls B in mountingholes 101 of the mask 100 by using a mounting unit having a differentstructure.

In addition, while the substrate transporting unit 520 is describedabove as fixing and transporting the substrate 10 by adsorbing the lowersurface of the substrate 10, a substrate transporting unit that fixesand transports the substrate 10 by using a different method other thanadsorption may also be configured.

According to the apparatus for mounting a conductive ball according tothe present disclosure, a process of mounting a conductive ball may beperformed by preventing deformation of a mask, thus achieving a highquality of the process without missing any conductive balls.

In addition, according to the apparatus for mounting a conductive ball,according to the present disclosure, a process of mounting a conductiveball having a very small size, on a substrate, may be performedeffectively.

What is claimed is:
 1. An apparatus for mounting a conductive ball, theapparatus comprising: a mask comprising a plurality of mounting holesformed such that a plurality of conductive balls is mounted in theplurality of mounting holes; a support plate supporting the mask toprevent deformation of the mask by blocking a lower portion of each ofthe plurality of mounting holes by contacting a lower surface of themask; a mounting unit mounting the plurality of conductive balls in theplurality of mounting holes of the mask while the mask is beingsupported by the support plate; a holding unit contacting an uppersurface of the mask to maintain the conductive balls respectivelymounted in the mounting holes of the mask, in a state of being mountedin the mounting holes; a transporting unit placing a substrate below themask by transporting at least one of the mask, the support plate, andthe substrate that is coated with a flux, while the holding unitmaintains the conductive balls in the state of being mounted in themounting holes of the mask; and a controller controlling operation ofthe mounting unit, the holding unit, and the transporting unit.
 2. Theapparatus of claim 1, wherein the holding unit comprises anelectrostatic chuck clamping the conductive balls mounted in themounting holes via an electrostatic force, and the controller stopsoperation of the electrostatic chuck of the holding unit when thesubstrate is placed below the mask such that the conductive ballsmounted in the mounting holes fall onto the substrate.
 3. The apparatusof claim 1, wherein the holding unit comprises a second adsorptionmember that is formed of a porous material and clamps, by vacuumadsorption, the conductive balls which are mounted in the mountingholes, and the controller stops operation of the second adsorptionmember of the holding unit when the substrate is placed below the masksuch that the conductive balls mounted in the mounting holes fall ontothe substrate.
 4. The apparatus of claim 1, wherein the support platecomprises a first adsorption member that is formed of a porous materialand adsorbs the conductive balls mounted in the mounting holes while thefirst adsorption member is in contact with the lower surface of themask, and the controller stops operation of the first adsorption memberwhen or before the holding unit operates in contact with the uppersurface of the mask.
 5. The apparatus of claim 4, wherein the firstadsorption member of the support plate is formed of a transparentmaterial.
 6. The apparatus of claim 5, wherein the support plateincludes a light-emitting portion that contacts the lower surface of themask to transmit light to the mounting holes of the mask.
 7. Theapparatus of claim 6, further comprising an inspection camera capturingan image of the mask from above the mask to inspect a mounting state ofthe conductive balls mounted in the mounting holes of the mask, whereinthe controller inspects a mounting state of the conductive balls mountedin the mounting holes of the mask by using the image captured using theinspection camera.
 8. The apparatus of claim 1, wherein the holding unitoperates such that the conductive balls mounted in the mounting holesare brought into contact with the holding unit, wherein the apparatusfurther comprises a separation unit separating, when the controllerstops operation of the holding unit, the conductive balls from theholding unit such that the conductive balls fall onto the substrate. 9.The apparatus of claim 8, wherein the separation unit separates theconductive balls from the holding unit by jetting a compressed airbetween the mask and the holding unit.
 10. The apparatus of claim 8,wherein the separation unit separates the conductive balls from theholding unit by moving the mask and the holding unit relative to eachother in a horizontal direction.
 11. The apparatus of claim 1, whereinthe transporting unit comprises a support plate transporting unittransporting the support plate relative to the mask, a substratetransporting unit transporting the substrate relative to the mask, and aholding unit transporting unit transporting the holding unit relative tothe mask.
 12. The apparatus of claim 1, wherein the support plate is atleast partially formed of a transparent material.
 13. The apparatus ofclaim 1, wherein the mounting unit comprises a cyclone head jetting acompressed air to the plurality of conductive balls disposed in achamber of the cyclone head to mount the plurality of conductive ballsin the mounting holes of the mask.